The APPMA, in conjunction with the AIP, have announced the four finalists for their sixth annual scholarship program.
The program will enable a packaging engineer the opportunity to complete a Diploma in Packaging Technology, valued at over $9000.
The Diploma is an internationally recognised Level 5 foundation degree qualification – specifically designed for packaging engineers – that prepares students to take responsibility for packaging operations at any level through the supply chain.
The 2014 finalists are:
- Aleah Back, Packaging Engineer, Johnson and Johnson Pacific,
- Alexandra Brayshaw, Research Assistant, Arthritis Australia,
- Mirvic Camacho, Packaging Engineer, Murray Goulburn
- Sumit Kini, Continuous Improvement Specialist, Orora Glass.
Last year’s scholarship winner, Jamie Schellebeck, is a Packaging Engineer at Amcor Fibre Packaging.
“Winning the scholarship in 2013 was a wonderful opportunity for me and I am eager to gain more technical expertise in the packaging industry by undertaking the Diploma in Packaging Technology. I look forward to graduating from the course in a few years.” Schelleback said.
The 2014 winner will be announced during the AIP National Conference which will be held on Tuesday the 17th and Wednesday the 18th of June at the Sofitel Sydney.